The tools available in the Cradle package, allow you to explore many critical areas. Everything
to ensure high quality design in the electronics.
- Analysis of active heat exchangers such as fans
- Wide range of heat transfer studies:
- Modelling of components in an electronic circuit – heating elements as well as heat exchangers
- Optimal arrangement of electric components and wiring patterns
- Calculated heat maps can be transfered to FEM mechanical module to calculate load stress on the board
